Chip Embedding of Power Semiconductors - Schweizer The power semiconductors are no longer soldered onto a printed circuit board as discretely pack- agedcomponents, but embedded in a so-called system printed circuit board (power and logic) using chip embedding technology
Chip-Embedded Technology Enables High Current Density Power DC-DC power modules in the past 10 years have evolved into new emerging, chip embedded technologies with newly enhanced thermal packaging techniques that allow for higher-density module designs in smaller form factors
Advancing Electric Vehicles with Innovative Chip Embedding and Driver . . . Advancing Electric Vehicles with Innovative Chip Embedding and Driver Technology Pioneering Efficiency and Reliability: Semiconductor Technology, Gate Drivers and Packaging embedded into a PCB with the Smart p2 Pack® technology from Schweizer Electronic AG is presented Double-pulse measurements as well as short circuit tests a
Next Generation Chip Embedding Technology for High Efficiency Power . . . Next Generation Chip Embedding Technology for High Efficiency Power Modules and Power SiPs Abstract: Cost, performance, and package size are some of the key drivers required in the next generation of package interconnect and package structure evolution
Embedding Technology - Unimicron Germany GmbH - en Unimicron Germany GmbH was able to successfully implement the technical feasibility of so-called chip embedding, i e the integration of power semiconductor chips (MOSFETs) into the PCB for various, also in-part State-funded projects, and subsequently prove both improved power properties and increased reliability