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- Thermal Stress Issues in Plated-Through-Hole Reliability
This chapter uses the finite element method (FEM) to examine the nature of the stress distribution within the PTH structure when the MLB is subjected to uniform thermal loads as seen in operational environments as well as to examine the thermal transients seen in wave soldering
- FEA Study of Solder Hole Fill Impact on the Reliability of . . .
In this work, FEA was employed to study the impact of the solder hole fill on PTH solder joint reliability in accelerated thermal cycling (ATC) and mechanical tests (including pull test and mechanical shock)
- Proof is in the PTH -- Assuring Via Reliability from Chip . . .
A valuable experimental tool for evaluating and understanding PTH behavior under cyclic temperature stress, and a critical starting point for any new resin system, construction, or surface finish, is the PTH life curve
- CHAPTER III Solder Joint Reliability Assessment - Virginia Tech
Thermal fatigue failure cause d by the CTE mismatches among silicon chip, substrate, and solder joint is the dominant failure mechanism in solder joint interconnections In this chapter, we evaluate the reliability of the produced solder joints for power chip interconnection
- Interactive effects of PTH and mechanical stress on nitric . . .
In sum, the present study suggests that PTH can directly interfere in the transduction of mechanical signals by osteoblastic cells by inhibiting stress-in-duced NO production
- Components to Assembly: Role of Model Based Physics-of . . .
Barrel Stress variation with respect to midplane Stress increases closer to mid plane; maximum barrel stress at mid plane Results of thermally induced stress analysis
- Improved Methodologies for Identifying Root-Cause of Printed . . .
Life prediction based on stress analysis and damage modeling, combined with traditional failure analysis, is a powerful tool in conclusively identifying design flaws or physical defects as the
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