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- Pactech
Discover our revolutionary Advanced Packaging Equipment for automated and high precision manufacturing Engage with us for highly customized Wafer Level Packaging services with our line-up of edge-leading capabilities installed We are supplying complete plating solutions by utilizing our plating know-how for a guaranteed process transfer
- ProAmpac Flexible Packaging
Pactech, which began manufacturing innovative flexible packaging in 1993, has expertise in pouch fitment and dispensing technology The business will become part of the ProAmpac brand and operate under Chief Commercial Officer Adam Grose
- Next generation Advanced Packaging using innovative laser assisted . . .
As the leading capacity in the area of laser enabled bonding of solder spheres and semiconductor elements, PacTech holds the key to a localized, low stress and selective bonding process by introducing the necessary energy optically via a laser
- Pactech. ai
We take pride in our exceptional solutions for cannabis testing, where our AI algorithms revolutionize the accuracy and efficiency of quality analysis Join PACTECH today and discover how our system can help propel your business to new levels
- PacTech - AnySilicon
PacTech-Packaging Technologies GmbH, established 1995 and a group member of NAGASE CO , LTD , manufactures equipment for the microelectronic advanced packaging industry and offers wafer level bumping packaging contract manufacturing out of Nauen, Germany (HQ), and through the 100% subsidiaries PacTech USA Inc , Silicon Valley, USA and
- Pactech
Based in the Silicon Valley, Pactech is a leading provider of custom cable and data center solutions Many of our cables are manufactured in the USA
- PacTech Packaging Technologies | Everything You Need to Know
PacTech is a technology-focused company specialized in advanced packaging equipment manufacturing and wafer level packaging services Since our establishment, our team has been working relentlessly on developing new leading-edge technologies for the next generation applications
- Pac Tech – Packaging Technologies GmbH | Semiconductor Materials and . . .
PacTech provides state-of-the-art automated equipment to the Wafer Level Packaging and Backend Industries This equipment is divided into three separate platforms: electroless-Ni Au Plating, Solder Bumping, and Backend Assembly
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