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- TOWA Corporation
TOWA is a leading company in the semiconductor molding equipment market We offer equipment using our proven transfer molding method, and high quality flow free compression molding method
- About Us | TOWA Corporation
In the field of semiconductors, where technological innovations are always in demand, we at TOWA Corporation have been working with our customers as their technical partner by developing cutting-edge technologies based on our world-leading technologies for ultra-precision molds
- Corporate Profile | TOWA Corporation
Forty years have passed since the development of our proprietary multi-plunger system, which has become the de facto standard, many unique technologies of TOWA have become trends in the field of semiconductor manufacturing
- TOWA株式会社
TOWAでは製品を導入いただいたお客様にさまざまなサポート サービスをご用意しています。
- Molding Equipment | TOWA Corporation
At TOWA, we market molding equipment (resin sealing equipment) that utilizes the transfer method With this method, a flowable resin for protecting the semiconductor chips is applied to the area around the semiconductor chip via a gate (supply port) before it is cured
- Products | TOWA Corporation
Developed by utilizing technologies cultivated through the manufacture of ultra-precision molds, End mills and Drills from TOWA boast high precision, superior abrasion resistance, and a long life-span
- IR情報 | TOWA株式会社
IR情報 | “世界最先端”をフィールドにする半導体パッケージングのソリューションカンパニー“次世代”をフィールドに
- CPM-Series | TOWA Corporation
The industry’s first single piece of equipment that is compatible with both granular resins and liquid resins Release film precutting system (patented) Approx 25% reduction in release film consumption per molding (compared to other products from TOWA) Environmentally friendly equipment that generates no waste
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