- YMTC Starts Shipping 5th Generation NAND Flash with 294 Layers
YMTC's design uses hybrid bonding to connect the memory array with logic components, suggesting that Chinese memory makers are up to speed on the packaging standards that their non-sanctioned competitors use The company has opted for a quiet release without formal announcements, a departure from typical industry practice
- Chinese YMTC Achieves Mass-production of 232-layer 3D . . . - TechPowerUp
The original Xtacking architecture from YMTC, which it debuted back in 2016, with layer counts going up to 64-layer, relied on cost-effective wafer-to-wafer bonding The YMTC 232-layer 3D NAND flash should find plenty of takers in the consumer electronics industry, spanning smartphones, consumer storage devices, TVs, and other appliances
- YMTC 3D TLC NAND Flash with Xtacking 4. 0 Tested: up to 14. 5 GB s . . .
The drive's architecture features a 2 GB LPDDR4X DRAM chip and two 3D TLC NAND dies utilizing 232-layer YMTC's Xtacking 4 0 architecture While initial testing revealed peak sequential read and write speeds of 14,527 MB s and 13,869 MB s respectively, these rates are sustained through the SLC cache for approximately 24 seconds
- Samsung Aims for 1,000-Layer NAND by 2030, Begins Wafer . . . - TechPowerUp
Samsung's plan involves working with China's YMTC, which should offer a hybrid bonding patent for V10 NAND ZDNet reports that the South Korean tech company will start making its V10 NAND in large quantities in the second half of 2025, with about 420-430 layers Besides wafer bonding, Samsung adds other technologies to its NAND plan
- PSA: SSDs with YMTC Flash Prone to Failure? Check Your SSDs! - TechPowerUp
The drive's architecture features a 2 GB LPDDR4X DRAM chip and two 3D TLC NAND dies utilizing 232-layer YMTC's Xtacking 4 0 architecture While initial testing revealed peak sequential read and write speeds of 14,527 MB s and 13,869 MB s respectively, these rates are sustained through the SLC cache for approximately 24 seconds
- YMTC Produces up to 500,000 Wafers Per Year of Leading . . . - TechPowerUp
Last year, YMTC, with its Xtacking 4 0 3D NAND flash architecture, was the first company to achieve a 200+ layer count in the 3D NAND space The company's product, X4-9070, a 232-layer TLC 3D NAND , uses multiple silicon wafers, hence growing its massive consumption of silicon that is projected to reach 500,000 wafers per year
- Lexar NS100 1 TB Specs | TechPowerUp SSD Database
YMTC 128L Xtacking 2 0 cell architecture consists of two decks connected through deck-interface buffer layer which is the same process with KIOXIA 112L BiCS 3D NAND structure Cell size, CSL pitch, and 9-hole VC layouts keep the same design and dimension (horizontal vertical WL and BL pitches) with previous 64L Xtacking 1 0 cell
- Netac NV7000-T 1 TB Specs | TechPowerUp SSD Database
It is only available in the 1 TB capacity listed on this page With the rest of the system, the Netac NV7000-T interfaces using a PCI-Express 4 0 x4 connection The SSD controller is the TC2201 from TenaFE, a DRAM cache is not available Netac has installed 232-layer QLC NAND flash on the NV7000-T, the flash chips are made by YMTC
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