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Homepage | Besi BE Semiconductor Industries N V (Besi) develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, cloud server, computing, automotive, industrial, LED and solar energy
Company Profile - Besi Besi is a global company with headquarters in Duiven, the Netherlands It operates eight facilities in Asia and Europe for development and production activities, as well as 13 sales and service offices across Europe, Asia and North America
Company | Besi Besi is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries offering high levels of accuracy, productivity and reliability at a low cost of ownership
Products Technology - Besi Besi develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, computer, automotive, industrial, LED and solar energy
BE Semiconductor Industries N. V. Announces Q2-25 Results | Besi Duiven, the Netherlands, July 24, 2025 - BE Semiconductor Industries N V (the “Company" or "Besi") (Euronext Amsterdam: BESI; OTC markets: BESIY), a leading manufacturer of assembly equipment for the semiconductor industry, today announced its results for the second quarter and first half year ended June 30, 2025
Investor Relations - Besi Besi is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries offering high levels of accuracy, productivity and reliability at a low cost of ownership
Company Overview - Besi Besi Netherlands, based in Duiven, the Netherlands, designs, develops and manages the production of molding, trim form and singulation systems for both leadframe, substrate and wafer level packaging applications under the Fico brand name
Press Releases - Besi Duiven, the Netherlands, April 23, 2025 - BE Semiconductor Industries N V (the "Company" or "Besi") (Euronext Amsterdam: BESI; OTC: BESIY), a leading manufacturer of assembly equipment for the semiconductor industry, today announced results of its Annual General Meeting of Shareholders (“AGM”)
Product details | Besi Besi’s patented Soft Solder Process Technologies, combined with the Esec 2100 SSI, help maintain a competitive edge in the market Demonstrations and sample builds with your material can be done on a live machine in one of our labs
Products Technology - Besi Besi’s die attach equipment is based on unique and innovative concepts offering economical benefits to customers Esec 2100 hS ix The Esec 2100 hS ix is the latest member of the 2100 i Die Bonder family