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Thermal TSV Optimization and Hierarchical . . . - IEEE Xplore Thermal through-silicon-vias (TTSVs) are TSVs that facilitate heat transfer across stacked dies without carrying signal and provide a potential thermal management solution to 3-D ICs However, the use of TTSVs increases the distance between IC blocks and signal delay
Trường Đại học Trà Vinh - tvu. edu. vn Trường Đại học Trà Vinh thành lập 03 trường thực hiện chức năng đào tạo, gồm: Trường Kinh tế, Luật và Trường Ngôn ngữ – Văn hóa – Nghệ thuật Khmer Nam bộ và Nhân văn, Trường Y Dược trên cơ sở sáp nhập các khoa đào tạo có lĩnh vực gần nhau
Thermal management of through-silicon vias and back-end-of . . . Through‑silicon via (TSV) and back-end-of-line (BEOL) structures, as core components of 3D ICs, are responsible for horizontal and vertical interconnections and directly affect the thermal transport performance within the chip
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