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Untitled Document [www. intel. com] The H-PBGA and HL-PBGA, however, are configured differently to provide for greater thermal and if required, electrical performance The thermal advantage provided by this design is based first upon attaching the die to the bottom surface of a heatspeader or slug that also forms the topside of the package Secondly, because the copper heatspreader forms the top of the package, the thermal
MCV 1,5 4-G-5,08 - Mouser Electronics PCB headers, nominal cross section: 1 5 mm2, color: green, nominal current: 8 A, rated voltage (III 2): 320 V, contact surface: Sn, contact connection type: Pin, number of potentials: 4, number of rows: 1, number of positions: 4, number of connections: 4, product range: MCV 1,5 -G, pitch: 5 08 mm, mounting: Wave soldering, pin layout: Linear