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2024 | News | DISCO Corporation DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools (blades and wheels) used for manufacturing semiconductors and electronic components
DISCO Corporate History | About DISCO | DISCO Corporation Since DISCO had transformed itself from a small abrasives shop to a leading manufacturer of precision processing tools and equipment and because the character of the company had changed, in 1977, Dai-Ichi Seitosho Co , Ltd took the D, I, S, and CO in its name and became DISCO
株式会社ディスコ - DISCO DISCO Technical Review Kiru（切る）・Kezuru（削る）・Migaku（磨く）技術に関する技術見解・ 論文のページです。
Corporate Philosophy | About DISCO | DISCO Corporation DISCO Values represent the corporate philosophy that identifies the ideal from various perspectives, including the direction in which the company should progress, the basic approach of management, and the manner in which each and every employee works
Investors | DISCO Corporation DISCO Management A Message to Investors To Investors Considering Purchasing DISCO Shares Top Message Corporate Philosophy Business Dividend Policy Return to Shareholders Business Risk Factors Corporate Governance Representative Executive Officer Evaluation Committee Disclosure Policy SDGs ESG CSR IR Library Preliminary Reports Financial
DFL7161 | Laser Saws | Product Information | DISCO Corporation DFL7161 is a fully automatic laser saw for Φ300 mm wafers which has already seen wide use It performs a series of processes from HogoMax * coating and dicing to automatic cleaning The HogoMax coating and cleaning sections are located separately to significantly reduce waiting time *A water-soluble protective film that prevents laser processing particles from adhering to the wafer surface
2023 | News | DISCO Corporation DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools (blades and wheels) used for manufacturing semiconductors and electronic components