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2024 | News | DISCO Corporation DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools (blades and wheels) used for manufacturing semiconductors and electronic components
Corporate Philosophy | About DISCO | DISCO Corporation DISCO Values represent the corporate philosophy that identifies the ideal from various perspectives, including the direction in which the company should progress, the basic approach of management, and the manner in which each and every employee works
株式会社ディスコ - DISCO DISCO Technical Review Kiru（切る）・Kezuru（削る）・Migaku（磨く）技術に関する技術見解・ 論文のページです。
DISCO Corporate History | About DISCO | DISCO Corporation Since DISCO had transformed itself from a small abrasives shop to a leading manufacturer of precision processing tools and equipment and because the character of the company had changed, in 1977, Dai-Ichi Seitosho Co , Ltd took the D, I, S, and CO in its name and became DISCO
DFL7161 | Laser Saws | Product Information | DISCO Corporation DFL7161 is a fully automatic laser saw for Φ300 mm wafers which has already seen wide use It performs a series of processes from HogoMax * coating and dicing to automatic cleaning The HogoMax coating and cleaning sections are located separately to significantly reduce waiting time *A water-soluble protective film that prevents laser processing particles from adhering to the wafer surface
2023 | News | DISCO Corporation DISCO Corporation, a semiconductor manufacturing equipment manufacturer (Head Office: Ota-ku, Tokyo; President: Kazuma Sekiya), has opened a new mid-process research center on July 1, 2023
2023 | News | DISCO Corporation DISCO Corporation, a semiconductor manufacturing equipment manufacturer (Head Office: Ota-ku, Tokyo; President: Kazuma Sekiya), has developed DDS2020, a fully automatic die separator that supports Φ200 mm tape frames and achieves separation of hard materials including SiC and sapphire
2025年 | ニュース | 株式会社ディスコ - disco. co. jp 半導体製造装置メーカー・株式会社ディスコ（本社：東京都大田区、社長：関家一馬）は、Great Place to Work ® Institute Japan（GPTW ※ ジャパン）が主催する、2025年版「働きがいのある会社」ランキングの大規模部門（従業員1,000人以上）にて第4位に選出されました。 17年連続でのランキング選出で