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TSMC Adjusts IC Packaging Policy to Navigate US Restrictions and . . . Specific conditions are set for export, re-export, or transfer based on transistor counts and the inclusion of high bandwidth memory (HBM) For example, packaged ICs with fewer than 30 billion transistors or those that do not contain HBM can be exported without restriction
IBMs New Tech Squeezes 30 Billion Transistors Into Fingernail-Sized . . . HIGHLIGHTS IBM has developed a new tech to make 5nm chips It will allow 30 billion transistors to be placed on a single chip It makes the use of Extreme Ultraviolet Lithography (EUV) IBM and its chip manufacturing partner companies Samsung and Globalfoundries still believe in Moore’s Law, and have just announced a new procedure […]
IBM unveils world’s first 5nm chip - Ars Technica Density is also through the roof, with IBM claiming it can squeeze up to 30 billion transistors onto a 50-square-millimetre chip (roughly the size of a fingernail), up from 20 billion transistors
IBM 2nm Breakthrough: Chip and Server Implications | Server Watch Using IBM’s nanosheet technology, the 2nm design will fit up to 50 billion transistors into a space roughly the size of a fingernail, up from 30 billion offered by the 5nm in 2017 With more transistors packed in, IBM has also infused more capabilities relevant to AI, cloud computing, and security Expected benefits outlined by IBM include: