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The Ultimate Chiplet Interconnect. - Eliyan - Home Interconnects play a significant role in enabling the performance and power requirements of Gen AI era data centers Eliyan’s NuLink and NuLink-X PHY technologies increase performance, improve power efficiency, and reduce total cost of ownership (TCO) unlike any other solution today
About - Eliyan The Ultimate Chiplet Interconnect In 2016, Eliyan Founder and CEO Ramin Farjadrad developed a breakthrough u2028die-to-die interconnect architecture that reached new levels of high bandwidth and low latency at best-in-class area and power efficiency
Products - Eliyan Eliyan uses NuLink-X technology to deliver low-power and high-performance chip-to-chip (C2C) IP core products Our PHY IP core products support multiple industry standards and are available on both standard packaging and advanced packaging
Technology - Eliyan Eliyan’s founding team has a long history of developing and productizing SBD technology, including its use in SerDes for IEEE 802 3bz (5GBase-T) and Automotive Ethernet (10G-BaseT1), and the use of SBD for D2D on 14nm ASICs in volume production with a large OEM customer
Chiplet Pioneer Eliyan Achieves First Silicon in Record Time with . . . Eliyan Corporation is leading the chiplet revolution, focusing on a fundamental challenge with scaling semiconductor performance, size, power, and cost to meet the needs of high-performance computing applications, from desktop to datacenter
Eliyan Closes $40M Series A Funding Round and Unveils Industry’s . . . About Eliyan Eliyan Corporation is leading the chiplet revolution, focusing on a fundamental challenge with scaling semiconductor performance, size, power, and cost to meet the needs of high-performance computing applications, from desktop to datacenter