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Golden Altos Corporation Looking for reliable gold wire bonding? Golden Altos, a trusted US OSAT provider, offers precision bonding down to 40µm inline ball bond, meeting MIL-STD-883 standards for military and aerospace See our capabilities: https: bit ly assemblycapabilitiesgoldenaltos #Wirebonding #Semiconductor #Assembly
About – Golden Altos Corporation Founded in 1991 and headquartered in Fremont California, Golden Altos Corporation (GAC) is a fast-paced full-service provider serving the semiconductor, military, aerospace industry as well as specialized commercial applications with quality service building both single chip and multichip modules
Contact – Golden Altos Corporation Single Chip ICs to Hybrids and Multi-Chip Modules (MCM) Military Aerospace Assembly and Testing; Wafer Processing: Backgrinding, Inspection, Saw, Plating
Careers – Golden Altos Corporation Join a team that values collaboration, innovation, and making a positive impact At Golden Altos, we're dedicated to building a culture where every voice is heard and every idea is valued Because at Golden Altos, how we do it matters
Assembly Services – Golden Altos Corporation Golden Altos offers complete on-shore, in-house, hermetic, high-reliability assembly including all quality conformance testing for MIL-STD-883 and MIL-PRF-38535 requirements For hybrids and MCMs, we currently build to the MIL-PRF-38534 standard
Assembly Capabilities – Golden Altos Corporation Golden Altos provides packaging services for engineering, prototyping, and production products Our military and space level packaging conforms to MIL-PRF-38535 requirements for monolithic devices and MIL-PRF-38534 for hybrids and MCMs
Process Flows – Golden Altos Corporation For monolithic devices, Golden Altos has five assembly process flows to handle requirements from “quick turn” engineering samples all the way through space level MIL-PRF-38535 (Class S) For hybrid devices, Golden Altos can customize a flow to match your particular needs or use one of our standard flows which follow MIL-PRF-38534
Press Release – Golden Altos Corporation Golden Altos Corporation’s new facility granted Commercial Laboratory Suitability Status by DLA Fremont, CA—March 11, 2024—We’re thrilled to announce that Golden Altos Corporation has received Commercial Laboratory Suitability Status
Package Configurations – Golden Altos Corporation Golden Altos is experienced in assembling a wide range of package types and sizes; from 3-lead LCCs to 559-lead PGAs and nearly everything in between We also cover a wide range of specialty hybrid packages
Assembly Capabilities Sealing and Encapsulation – Golden Altos Corporation Sealing and encapsulation are important processes in microelectronics manufacturing that protect and extend the life of electronic components Golden Altos offers advanced sealing and encapsulating solutions customized to your specific needs