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NANO - Die Bonder and Flip Chip Bonder - ASMPT ASMPT AMICRA’s ultra-precision die bonder flip chip bonder which supports ± 0 2µm @ 3s placement accuracy, offering the highest placement accuracy in its class!
PDP - Amicra NOVA UPH up to 4000 (±10µM @ 3sigma, including Flip-Chip) UPH up to 1200 (±3µM @ 3sigma, including Flip-Chip) Flip-Chip Die Attach options Automatic load of Wafer Substrate Dynamic alignment Eutectic bonding via diode-laser or heating plate hot bond tool Epoxy stamping dispensing options Micro dispensing; dot size up to 150µM Wafer mapping
Die Bonding - CWI Technical Sales It is a fully automated all-purpose system built on a sophisticated granite gantry and high precision motion control system This system can be upgraded with new loader and unloader modules With numerous available options, it can be customized to suit all market needs
ASMPT AMICRA ASMPT AMICRA GmbH ASMPT AMICRA GmbH is a worldwide leading supplier of ultra high precision Die Attach Equipment specializing in submicron placement accuracy (±0 2µm@3s) Our equipment offering supports: Die Attach and Flip Chip Bonding High Speed Dispense System and Custom Solutions
Advanced die and flip chip bonders - EPP Europe The ultra-high-precision Amicra AFC Plus bonding system was designed as a modular concept for utmost user flexibility and customer accommodation AFC Plus realizes a placement accuracy of +0 5µm at 3 Sigma for die and flip-chip attach
ASMPT AMICRA | Photonics Buyers Guide | Photonics Marketplace Provides die attach and flip chip bonders with focus on: opto, silicon photonics, AOC, VCSEL, laser diode, WLP, 2 5D 3D IC, TSV, TCB, fanout EWLP, automotive sensors lidar and MTB for advanced LED displays
AMICRA NANO | ASMPT SEMI Solutions NANO - Die Bonder and Flip Chip Bonder ASMPT AMICRA‘s die bonding technology was specifically designed to serve the photonic assembly market by providing the ultimate placement accuracy while supporting a high speed AuSn eutectic bonding process
Slides -- Die Flip Chip Bonders, LED Test Sort and Wafer Ink Systems Used for flip chip or lens attach processes where the alignment structures of a die lens are not visible from the top side Cyan frame shows ±3μm range All parts of the group with less epoxy are clearly inside of the window
Amicra introduces the NANO: Ultra-precision die attach at +0. 3µm . . . With its newly announced NANO, an ultra-precision die and flip-chip bonder for highly demanding assembly tasks, AMICRA Microtechnologies GmbH, a worldwide leading vendor of back-end processing equipment for advanced packaging applications, is setting another record mark for die-attach accuracy