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Mattson Technology, Inc. We design, manufacture, market and globally support semiconductor wafer processing equipment used in the fabrication of integrated circuits
Company Overview - Mattson Technology, Inc. Mattson Technology was founded in 1988 in Fremont, California After breaking into the semiconductor equipment industry as a leading supplier of dry strip equipment, we expanded our portfolio of processing equipment to also include plasma etch, rapid thermal anneal and millisecond anneal
Technology - Mattson Technology, Inc. Leading-edge wafer processing at high productivity levels providing customers with the most cost-effective manufacturing solution
Rapid Thermal Processing - Mattson Technology, Inc. RTP refers to a process that heats silicon wafers to high temperatures (up to 1200°C or greater) using high intensity lamps to set the electrical properties of the semiconductor devices Our thermal products now include a wide range of rapid anneals ranging from soak to spike to millisecond flash Our Helios family RTP systems offer unique double-side heating RTP technology It can achieve
Mattson Technology Locations Sales and Service Office Mattson International GmbH Manfred-von-Ardenne-Ring 20 01099 Dresden, Germany
Dry Strip - Mattson Technology, Inc. Dry strip is the removal of the masking layers from the wafer after the patterning process has been completed The objective is to eliminate the masking material from the wafer as quickly as possible, without allowing any surface materials to become damaged We are a leader in the dry strip market Our strip systems offer…Read More »
Plasma ETCH - Mattson Technology, Inc. Etching is the process of selectively removing mask patterned materials from the wafer’s surface to create desired patterns on the wafer’s surface Plasma etch is the use of a radio frequency (RF) excited plasma to produce chemically reactive species from various gases The reactive plasma is exposed to the wafer surface and etches away the…Read More »
Aspen - Mattson Technology, Inc. Aspen® III Based on proprietary ICP source design with grounded Faraday shield, Aspen III delivers production proven and cost-effective strip and etch solutions to semiconductor manufacturers worldwide The Aspen III’s exceptional platform design can handle both 200 mm and 300 mm wafers, and supports special wafer handling including warped and translucent wafers The unique process chamber
Surface Treatment and Ultra-Selective Materials Removal - Mattson . . . Based on an industry leading remote plasma technology, Mattson Technology’s Novyka ® family selective etch systems offer unique process solutions and deliver outstanding results in isotropic and anisotropic etch of various dielectric and conductor materials