copy and paste this google map to your website or blog!
Press copy button and paste into your blog or website.
(Please switch to 'HTML' mode when posting into your blog. Examples: WordPress Example, Blogger Example)
Input Form:Deal with this potential dealer,buyer,seller,supplier,manufacturer,exporter,importer
(Any information to deal,buy, sell, quote for products or service)
Governing Factors of Processing Quality for the Silicon Wafer Thinning . . . The processing quality of backgrinding is evaluated using indices such as TTV (Total Thickness Variation), saw marks on the front side, and die strength As the backgrinding process directly contributes to the yield and reliability of the device, a high processing quality is required even for the thinning process of general silicon wafers From the “equipment configuration” perspective
Dicing Thin Wafers | Blade Dicing | Solutions | DISCO CORPORATION As stated above, it is generally advisable to dice thin wafers with an extremely fine-grit blade But because these blades have reduced cutting power, they can be affected by films, TEGs, and other elements of the wafer frontside Clogging can result, in turn compromising processing quality on the wafer backside In such a case, the use of a step cut (instead of single-pass dicing) often
Adoption of Hybrid Dicing Technique to Minimize Sawing-Induced Damage . . . This article demonstrates that the chipping damage resulting from silicon wafer separation can be more effectively suppressed by the adoption of hybrid dicing (a duel process that uses laser ablation prior to mechanical sawing) than single dicing, such as sawing This work shows that the adoption of the hybrid dicing technique induces sacri cial fracture at the laser-induced groove tip to save
From Wafer to Chip: The Importance of Dicing - D X From Wafer to Chip: The Importance of Dicing The production of integrated circuit (IC) chips involves several complex steps, starting from the fabrication of silicon wafers to the creation of individual semiconductor devices One of the most vital processes in this process is dicing, where a completed wafer is carefully sliced into thousands of separate chips This step requires exceptional
Blade Dicing | Solutions | DISCO CORPORATION To provide the processing results that these companies require, DISCO continuously researches and develops the machines, blades, and applications that make thin wafer dicing a reality Blade Height Control Function In some dicing applications, cut depth (= blade height) needs to be controlled with high precision
Silicon wafer thinning, the singulation process, and die strength - DISCO For wafer thinning, the grinding process with a grinder is normally used from the viewpoints of cost and productivity Since wafers are ground in the brittle mode, streaks called saw marks as shown in Fig 1 are created and a damaged layer remains on the processed surface
DBG SDBG | Solutions | DISCO CORPORATION DBG (Dicing Before Grinding) Process DBG reverses the usual process of fully dicing the wafer after grinding In DBG, first the wafer is half-cut with a special dicing saw Then, die singulation occurs when the wafer is thinned below the level of this cut
Ultra-Thin Grinding | Grinding | Solutions | DISCO CORPORATION DISCO delivers complete ultra-thin grinding solutions that comprise four key elements: machine, grinding wheel, protective tape, and processing conditions Application Examples Photo 1 shows a Φ300 mm silicon wafer reduced to 5 µm thickness by grinding only
Plasma Dicing Solutions of a Variety of Materials - Samco Its plasma dicing technology enables reliable dicing processes, regardless of wafer and chip sizes Addi onally, the technology could be applied to a wide variety of dicing applica ons such as circular chips, silicon wafers with metal or resin layers, and compound semiconductors
Introduction of Plasma Scribing Technology on GaAs Wafers Using ICP Etching viable solution for back-end processing of these wafers is plasma scribing technology using ICP etching equipment While diamond scribing and blade dicing are common methods for wafer singulation, their wider scribing line widths (ranging from 50 μm to 100 μm) limit chip production, resulting in device defects and diminished yields Plasma scribing, however, facilitates the processing of