copy and paste this google map to your website or blog!
Press copy button and paste into your blog or website.
(Please switch to 'HTML' mode when posting into your blog. Examples: WordPress Example, Blogger Example)
Input Form:Deal with this potential dealer,buyer,seller,supplier,manufacturer,exporter,importer
(Any information to deal,buy, sell, quote for products or service)
Thermal Stress Issues in Plated-Through-Hole Reliability This chapter uses the finite element method (FEM) to examine the nature of the stress distribution within the PTH structure when the MLB is subjected to uniform thermal loads as seen in operational environments as well as to examine the thermal transients seen in wave soldering
FEA Study of Solder Hole Fill Impact on the Reliability of . . . In this work, FEA was employed to study the impact of the solder hole fill on PTH solder joint reliability in accelerated thermal cycling (ATC) and mechanical tests (including pull test and mechanical shock)
Proof is in the PTH -- Assuring Via Reliability from Chip . . . A valuable experimental tool for evaluating and understanding PTH behavior under cyclic temperature stress, and a critical starting point for any new resin system, construction, or surface finish, is the PTH life curve
CHAPTER III Solder Joint Reliability Assessment - Virginia Tech Thermal fatigue failure cause d by the CTE mismatches among silicon chip, substrate, and solder joint is the dominant failure mechanism in solder joint interconnections In this chapter, we evaluate the reliability of the produced solder joints for power chip interconnection