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Ormet® 701 - Insulectro Ormet® PCB-701 is a lead-free conductive paste used to fill micro via structures that create z-axis interconnections between circuit layers in semiconductor packaging and printed circuit boards
Ormet Corporation - Encyclopedia. com Ormet Corporation is a privately owned manufacturer of alumina and primary aluminum whose headquarters are located in Canonsburg, Pennsylvania Ormet's specialty alumina materials are used in aluminum production as well as abrasives, refractories, ceramics, and electrical insulation as a fire retardant
Ormet Circuits - SMTnet Ormet Circuits: Manufacturer of sintering, electrically conductive materials Applications include semiconductor die attach, component attach, via fill, z-axis interconnection, conductive lines and traces and plated-through hole fill
AI Technology Completes Strategic Acquisition of Ormet Circuits Inc. Circuits Inc (Ormet) from EMD Electronics, the U S and Canada Electronics business of Merck KGaA, Darmstadt, Germany This milestone represents a significant step forward in AIT’s strategic expansion in advanced material solutions for semiconductor packaging and assembly
Ormet Technology Overview May 2012. pptx •Ormet Circuits provides conduc2ve pastes that enable electrical interconnecon and thermal management in electronic substrates, components and assemblies
Ormet: Uses, Dosage, Side Effects, Food Interaction FAQ Ormet treats amebiasis, trichomoniasis, and giardiasis, exerting both antibacterial and antiprotozoal activities Ormet is an effective treatment for some anaerobic bacterial infections
Ormet TLPS Introduction Uses, drivers, and advantages Design Flexibility for higher density Ormet pastes eliminate complex drilling and plating processes,
AI TECHNOLOGY, INC. - Insulectro Ormet ® pastes are lead-free, highly electrically and thermally conductive, and provide good solderability at relatively low temperatures During the curing process, the material forms a solid metal, alloying with the copper circuits in the Z-axis
Ormet Circuits Inc. introduces new Transient Liquid Phase Sintering Paste Ormet DAP-491-1 is an excellent alternative to gold-based and lead-based solders as well as silver-sintering materials for electronic packaging applications requiring high thermal conductivity, high-temperature stability along with standard SMT-compatibility for high-throughput