copy and paste this google map to your website or blog!
Press copy button and paste into your blog or website.
(Please switch to 'HTML' mode when posting into your blog. Examples: WordPress Example, Blogger Example)
Input Form:Deal with this potential dealer,buyer,seller,supplier,manufacturer,exporter,importer
(Any information to deal,buy, sell, quote for products or service)
沛顿科技（深圳）有限公司 - payton. com. cn With a registered capital of RMB 1 748 billion and a total investment of RMB 2 billion Since its establishment, Payton has been focusing on high-end memory chip (DRAM, NAND FLASH) assembly and testing services, with assembly and testing mass production capabilities for dynamic memory chip and SSD
沛顿科技（深圳）有限公司 - payton. com. cn Payton is committed to provide fair employment opportunities to all qualified personnel We have several recruitment channels, include network recruitment, technical school campus recruitment, agency and inside recommendation, etc
沛顿科技（深圳）有限公司 - payton. com. cn 沛顿科技（深圳）有限公司 Wafer BSG: Wafer size: 12 inch Wafer thickness: min 30um BSG thickness tolerance: + -3um Wafer Dicing: Dicing method: Blade, Laser Die Bonding Die Size: min 0 2mm*0 2mm Adhesive materials: Glue, DAF, FOW Die stack capability: 2D, 4D, 8D, 16D Die Bonding accuracy: + -15um Wire Bonding Bond pad pitch: min 45um Bond pad size: min 40um Wire loop: min 30um Gold