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JGD ASSOCIATES; INC

AVON-USA

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Corporate Name:
JGD ASSOCIATES; INC
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Company Address: 92 Moore Road,AVON,OH,USA 
ZIP Code:
Postal Code:
44011 
Telephone Number: 4408990884 (+1-440-899-0884) 
Fax Number: 4408991185 (+1-440-899-1185) 
Website:
falzine. com 
Email:
 
USA SIC Code(Standard Industrial Classification Code):
861102 
USA SIC Description:
Associations 
Number of Employees:
 
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Company News:
  • 杜正恭 JGD LAB
    2025 4 18 杜老師赴南投 暨南大學 Natou NCNU參加TFS會議並發表演講
  • JGD LAB - r429jgd. wixsite. com
    *National Tsing-Hua University, Hsinchu, Taiwan *Tel Fax: 886-3-5712686 *Email: jgd@mx nthu edu tw *Homepage: http: r429jgd wix com jgdlab Educational Background: 1 School of Materials Engineering, Purdue University, May 1979 to March 1983 (Ph D awarded May 1983) 2 School of Nuclear Engineering, Purdue University, Aug 1977 to
  • 儀器基本介紹 | jgdlab
    TEL: (03)5715131 Ext 31164 或 5712686 E-MAIL: jgd@mx nthu edu tw 技術員 : 蔡淑月小姐 TEL: (03)5715131 Ext 35414 E-MAIL: sytsai@mx nthu edu tw 儀器室地點: 清華大學材料科技館112室 基本參考資料: (1)"Scanning Electron Microscopy and X-ray Microanalysis", 3rd Ed J I Goldstein et al (Plenum Press, 2003)
  • Members - jgdlab
    講座教授 電話與傳真: 886-3-5712686 電子信箱: jgd@mx nthu edu tw 網頁: http: r429jgd wix com jgdlab 學歷 美國普度大學材料工程博士 (1979 5-1983 3) 美國普度大學核工研究所 (1977 8-1979 5) 國立清華大學核工研究所 (1976 9-1977 6) 國立清華大學核子工程系學士 (1970 9-1974 6
  • Prof. Duh | jgdlab
    講座教授 電話與傳真: 886-3-5712686 電子信箱: jgd@mx nthu edu tw 網頁: http: r429jgd wix com jgdlab 學歷 美國普度大學材料工程博士 (1979 5-1983 3) 美國普度大學核工研究所 (1977 8-1979 5) 國立清華大學核工研究所 (1976 9-1977 6) 國立清華大學核子工程系學士 (1970 9-1974 6)
  • Package | jgdlab
    一 電子封裝研究的演變 電子構裝 (electronic packaging)目前衍生出CSP(Chip Size Package)、BGA(Ball Grid Array)與FC(Flip Chip)等製造技術,CSP是指封裝後的IC大小不得超過原來晶片Chip的面積大小的20%以上, BGA球閘陣列封裝為第三代面矩陣式(Area Array)IC封裝技術,係在晶片底部以陣列的方式佈置許多錫球
  • 口頭報告 3 | jgdlab
    C321 C C Chang and J G Duh, "Ultra-High Temperature Tribological Characteristics in Si Modified CrAlSiN Nanocomposite Coatings", 10th Anniversary AEPSE Conference
  • 期刊論文 - jgdlab
    A499 Zih-You Wu, Yin-Ku Lee, Su-Yueh Tsai, Po-Yu Chen, Jenq-Gong Duh, "Investigating microstructure and mechanical property of full solid phase joints by applying low temperature solder", Vacuum, Volume 242, December 2025, 114763 A498 Pin-Ling Lin, Zih-You Wu, Yin-Ku Lee, Zi-Xu Chen, Ta-Wei Lin, Po-Yu Chen, Jenq-Gong Duh, "Grain refinement and interfacial IMCs suppression via Zn addition to
  • Battery | english-version
    Human beings currently have paid much attention to the energy issue, and the studies of lithium ion batteries have thus become an essential subject Additionally, the portable electronic devices, such as cellular phone, personal computer (PC), MP3 players, and iPod, are now widely used These applications require a high energy density of LIBs and consumers desire smaller, lighter, longer
  • Introduction | jgdlab
    杜正恭實驗室 (Duh’s Lab)之研究工作係基植於材料科技之開發與應用,30 多年前在美國所受的訓練是建立基礎材料科學之奠石,如熱力、動力、擴散,輔以電子顯微鏡分析 (SEM+EDS)從事材料之鑑定與分析。歸國服務垂 33 年,係以美國所學的為基礎,配合台灣的環境,首先從事鐵鋁錳合金之顯微結構




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