JGD REAL ESTATEBusiness Directories,Company Directories

Company Name: Corporate Name:	JGD REAL ESTATE
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Company Address:	551 Livingston St,NORWOOD,NJ,USA
ZIP Code: Postal Code:	07648-1312
Telephone Number:	2017840453 (+1-201-784-0453)
Fax Number:	2017840617 (+1-201-784-0617)
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USA SIC Code(Standard Industrial Classification Code):	653118
USA SIC Description:	Real Estate
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杜正恭 JGD LAB
2024 12 25 Last dance in Christmas 2024 12 11 磨練、磨練、再磨練 2024 11 27 日本失落的30年
JGD LAB - r429jgd. wixsite. com
＊National Tsing-Hua University, Hsinchu, Taiwan ＊Tel Fax: 886-3-5712686 ＊Email: jgd@mx nthu edu tw ＊Homepage: http: r429jgd wix com jgdlab Educational Background： 1 School of Materials Engineering, Purdue University, May 1979 to March 1983 (Ph D awarded May 1983) 2 School of Nuclear Engineering, Purdue University, Aug 1977 to
Prof. Duh | jgdlab
目前職務國立中興大學材料分析講座教授 (2022 8-2025 7) Co-Editors-in-Chief, Materials Chemistry and Physics（Elsevier） (2018 9-迄今) 國立清華大學材料科學工程學系-榮譽退休教授 (2022 2-迄今) 國立清華大學材料科學工程學系-講座教授 (2012 4-2022 1) 經歷 2022 8-2025 7: 國立中興大學材料分析講座教授 2022 2-迄今: 國立
Members - jgdlab
講座教授電話與傳真: 886-3-5712686 電子信箱: jgd@mx nthu edu tw 網頁: http: r429jgd wix com jgdlab 學歷美國普度大學材料工程博士（1979 5-1983 3）美國普度大學核工研究所（1977 8-1979 5）國立清華大學核工研究所（1976 9-1977 6）國立清華大學核子工程系學士（1970 9-1974 6
儀器基本介紹 | jgdlab
儀器中文名稱：高解析度場發射電子微探儀儀器英文名稱：High Resolution Hyper Probe JXA-iHP200F 儀器英文簡稱：FE-EPMA 儀器購置年月：2020年 3 月儀器裝機年月：2020年 1 月至3月儀器經費來源：科技部、清華大學廠牌及型號：日本 JEOL，JXA-iHP200F 重要規格： 8個分析單晶 TAP, LDEB, LIF, LIFH, PETL, PETH, LDE1H,LDE2H
Project | jgdlab
160 高能量、高安全之正負極及固態電解質材料開發與改質以促進鋰離子電池於電動車、儲能系統上之應用
Postdoctoral researcher - jgdlab
Contact Us: Tel: 03-5715131 ext 33857 National Tsing Hua University Materials Science Technology Building R429
Ph. D. Student | jgdlab
Contact Us: Tel: 03-5715131 ext 33857 National Tsing Hua University Materials Science Technology Building R429
靜虛動語錄 | jgdlab
Contact Us: Tel: 03-5715131 ext 33857 National Tsing Hua University Materials Science Technology Building R429
期刊論文 - jgdlab
A497 陳子緒, 吳子游, 林大為, 杜正恭, "Ni基板添加增強Cu6Sn5晶界擴散對Cu3Sn之影響", 鑛冶：中國鑛冶工程學會會刊, 69卷1期, 民國114年3月 A496 Yin-Ku Lee, Yun-Chen Chan, Zih-Yu Wu, Su-Yueh Tsai, Shou-Yi Chang, Jenq-Gong Duh, "Microstructural stability enhancement and mechanical reinforcement of TLP-bonded Cu Sn-3 5Ag Cu microbumps under multiple reflow