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TOWA Corporation TOWA is a leading company in the semiconductor molding equipment market We offer equipment using our proven transfer molding method, and high quality flow free compression molding method
About Us | TOWA Corporation In the field of semiconductors, where technological innovations are always in demand, we at TOWA Corporation have been working with our customers as their technical partner by developing cutting-edge technologies based on our world-leading technologies for ultra-precision molds
Corporate Profile | TOWA Corporation Forty years have passed since the development of our proprietary multi-plunger system, which has become the de facto standard, many unique technologies of TOWA have become trends in the field of semiconductor manufacturing
Molding Equipment | TOWA Corporation At TOWA, we market molding equipment (resin sealing equipment) that utilizes the transfer method With this method, a flowable resin for protecting the semiconductor chips is applied to the area around the semiconductor chip via a gate (supply port) before it is cured
Products | TOWA Corporation Developed by utilizing technologies cultivated through the manufacture of ultra-precision molds, End mills and Drills from TOWA boast high precision, superior abrasion resistance, and a long life-span
CPM-Series | TOWA Corporation The industry’s first single piece of equipment that is compatible with both granular resins and liquid resins Release film precutting system (patented) Approx 25% reduction in release film consumption per molding (compared to other products from TOWA) Environmentally friendly equipment that generates no waste
Southeast Asia | TOWA Corporation TOWA Group (Overseas) TOWA’s global network enables detailed marketing and services and efficient production Southeast Asia